Camera Module and Molded Circuit Board Assembly and Manufacturing Method Thereof

ABSTRACT

A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.

CROSS REFERENCE OF RELATED APPLICATION

This application is a Continuation application that claims the benefitof priority under 35 U.S.C. §119 to a non-provisional application,application Ser. No. 15/387,613, filed Dec. 21, 2016, which isincorporated herewith by reference in its entity.

NOTICE OF COPYRIGHT

A portion of the disclosure of this patent document contains materialwhich is subject to copyright protection. The copyright owner has noobjection to any reproduction by anyone of the patent disclosure, as itappears in the United States Patent and Trademark Office patent files orrecords, but otherwise reserves all copyright rights whatsoever.

BACKGROUND OF THE PRESENT INVENTION Field of Invention

The present invention relates to camera modules, and more particularlyto a camera module and molded circuit board assembly and manufacturingmethod thereof.

Description of Related Arts

A camera module is one of the indispensable components of an intelligentelectronic device such as smartphone, camera, computer device, wearabledevice, and the like. With the continuous development of a variety ofintelligent devices and the popularity of the intelligent devices, thecamera module requirements are getting higher and higher.

In recent years, intelligent electronic devices have been developed byleaps and bounds, the growing trend of the intelligent electronicdevices is towards thinner and thinner. In order to adapt suchdevelopment, the camera module of the intelligent electronic device isrequired to be multi-functional, lightweight and compact in size, sothat electronic equipment can be made thinner and thinner while meetingits imaging requirements. Therefore, the camera module manufacturerscontinue to focus on designing and manufacturing camera modules thatmeet these requirements.

Molded packaging technology is an emerging packaging technologydeveloped from the conventional COB (Chip on Board) packagingtechnology. As shown in FIG. 1A of the drawings, a circuit boardencapsulated by a conventional integrated packaging technology isillustrated. In this structure, the encapsulation portion 1 isintegrally encapsulated on a circuit board 2 and a photosensitive chip3, and the electronic components on the circuit board and the leads forelectrically connecting the chip and the circuit board are covered, sothat the occupied space of the electronic components is reduced, thesize of the camera module can thus be reduced, and the problem that thedust attached to the electronic component affecting the image quality ofthe camera module is solved too.

Compared with the conventional holder-type COB packaging technology,this packaging technology has more advantages in theory. However, in aperiod of time, this package technology only stays in the theoretical ormanual experimental stages, and did not get very good implement, and isnot put into actual production for quantitative production. The reasonsare following aspects.

Firstly, although the integral packaging technology in other largeindustrial areas is a well-known technology, in the field of cameramodule, it is a new application. Different industries need to molddifferent objects with different problems. For example, the body of asmartphone becomes thinner and thinner, so that the thickness of thesmartphone becomes thinner and thinner. As a result, camera modules arealso required to have such a thinner thickness to avoid the increase ofthe overall thickness of the phone. It is understandable that componentsof the camera module are manufactured in a relatively small size level,so that the ideal structure of the camera module cannot be produced bythe conventional methods. In the above-described configuration, it isusually necessary to form a through-hole, which is usually designed tohave a vertical prismatic column shape, in the encapsulation portion 1to provide a light path for the photosensitive chip 3 on the circuitboard 2. The structure has not particularly large defects in theory, butit is not taking the actual production into account. In other words,this technology is only in the handmade test stage instead of being putinto actual mass productions. More specifically, as a molding mould isgenerally needed in the packaging technology, as shown in FIG. 1B andFIG. 1C of the drawings. When a molding block 4 of an upper mould of themolding mould is a vertical prismatic column, during a molding process,on the contacting position of the upper mould and the encapsulationportion 1, and when the mould is detaching from the molding material, asthe bottom of the upper mold is sharp-edged, the upper mould influencesthe shape of the encapsulation portion 1 when the mould is opened fordemoulding and causes deformation of the encapsulation portion 1 such asan occurrence of flashing. In addition, when the upper mould is beingpulled out and moved away from the encapsulation portion 1, an outerside surface of the molding block 4 of the upper mould and theencapsulation portion 1 have a large frictional force therebetween andthe encapsulation portion 1 may be damaged. This adverse effect islikely to be negligible in an industry of a relatively large sizeproduct, but in the camera module field that has a small in size andfine and precise requirement, it becomes a critical factor. Therefore,the vertical prismatic column shaped through-hole structure is feasiblein theory but is not suitable for mass productions in practice.

Secondly, a camera module is an optical electronic device and light isan important factor to determine the image quality. As shown in FIG. 1Dof the drawings, in the conventional holder assembling manner, theholder 5 mounted on the circuit board is required to reserve a mountingspace 6 for the electronic components. The mounting space 6 forms anindent space and increases the size of the camera module. However, afterthe light incidents, there is less light directly projecting to theinner wall of the holder. Therefore, the reflected light of the innerwall of the holder is less and does not affect the imaging quality. Asshown in FIG. 1E of the drawings, when the holder is replaced into theconventional prismatic column-shaped encapsulation portion 1, comparedwith the structure of the holder, after light incidents on the lens in asame incident angle, there is no reflected light in the holder, but theintegral package structure affects the inner wall of the encapsulationportion 1 and the reflected light easily reaches the photosensitive chip3 so as to increase the influence of stray light and that the imagingquality of the cameral module is degraded accordingly. Therefore, in theaspect of the optical imaging quality, the prismatic column shapedthrough-hole configuration formed in the encapsulation portion 1 is notsuitable for industrial application.

Last but not least, when the encapsulation portion 1 is assembled in acamera module, it is necessary to mount a lens or a motor to theencapsulation portion 1, so that the encapsulation portion 1 is neededto meet a certain structural strength. Therefore, the shape of theencapsulation portion 1 should be designed in regard to the light flux,the structural strength, the light reflectivity, and the damageprevention during demoulding etc. However, the structure of theconventional encapsulation portion 1 is obviously not consideredregarding these factors.

SUMMARY OF THE PRESENT INVENTION

The invention is advantageous in that it provides a camera module and amolded circuit board assembly thereof and a manufacturing methodthereof, wherein the camera module comprises the molded circuit boardassembly which is capable of enabling a large-scale mass production by amolding mould through a molding process.

Another advantage of the invention is to provide a camera module and itsmolded circuit board assembly and manufacturing method, wherein themolded circuit board assembly comprises a circuit board, aphotosensitive element and a molded base integrally formed on thecircuit board, and the molded base forms a light window, wherein thelight window is not a prismatic column shape of the prior art, so thatin a manufacturing process, the damage to the molded base by a lightwindow forming block of the molding mould is reduced, and it isconvenient to the removal the light window forming block duringdemoulding.

Another advantage of the invention is to provide a camera module and itsmolded circuit board assembly and manufacturing method, wherein at leastone portion of the molded base integrally is extended from the circuitboard and an optical axis direction forms a first inclination anglewhich is an acute angle and is benefit for demoulding of the moldedbase, wherein after the molded base is formed by the molding process,the light window forming block is able to be smoothly pulled out duringdemoulding to reduce friction with the molded base, so that the moldedbase is kept in its original shape and condition without damage toreduce the influence of the removal of the light window forming block.

Another advantage of the invention is to provide a camera module and itsmolded circuit board assembly and manufacturing method, wherein at leastone portion of the inner side surface of the molded base extendingintegrally from the top surface of the circuit board and the opticalaxis form an angle which is defined as a first inclination angle, sothat the light incident on the inner side surface is less likely toreach the photosensitive element, and the influence of the stray lighton the image quality is reduced.

Another advantage of the invention is to provide a camera module and itsmolded circuit board assembly and manufacturing method, wherein at leastone outer side surface of the molded base and the optical axis form anangle which is an acute angle and is defined as a second inclinationangle, wherein when the molded base is manufactured by the molding mouldand when dividing blocks of the molding mould are detached at theoutside of the molded base, the friction between the dividing blocks ofthe molding mould and the outer side surface of the molded base isremained unchanged such that the dividing blocks of the molding mouldare easy to remove out.

Another advantage of the invention is to provide a camera module and itsmolded circuit board assembly and manufacturing method, wherein theinner side of the molded base successively has a first portion innerside surface inclined from the circuit board, a second portion innerside surface extending from the first portion inner side surface, and athird portion inner side surface aslant extending from the secondportion inner side surface, wherein the third portion inner side surfaceand the optical axis form an angle which is an acute angle and isdefined as a third inclination angle, so that when the light windowforming block of the molded base is released, the friction between thebase portion of the light window forming block and the inner side of thetop end of the molded base is reduced, so that the second portion innerside surface of the molded base is remained unchanged such that thedividing blocks of the molding mould are easy to remove duringremoulding.

Another advantage of the invention is to provide a camera module and itsmolded circuit board assembly and manufacturing method, wherein thefirst inclination angle is in a predetermined range to facilitate themould release of the molded base without damaging the molded base.

Another advantage of the invention is to provide a camera module and itsmolded circuit board assembly and manufacturing method, wherein thebottom side of the molding mould is generally provided with an elasticfilm layer and the inclination angles are not right-angles so as toprevent piercing through the film layer.

Another advantage of the invention is to provide a camera module and itsmolded circuit board assembly and manufacturing method, wherein themolded base has a top side surface, the first, second and thirdinclination angles are restricted within predetermined rangesrespectively to facilitate removal of the light window forming block andthe dividing blocks, so that the size of the top side surface is not toosmall to provide a firm mounting area for a lens actuator or a lens ofthe camera module.

Another advantage of the invention is to provide a camera module and itsmolded circuit board assembly and manufacturing method, wherein thefirst, second and third inclination angles are restricted withinpredetermined ranges respectively to facilitate removal of the lightwindow forming block and to provide a firm mounting area for an opticalfilter or an optical filter holder of the camera module.

Another advantage of the invention is to provide a camera module and itsmolded circuit board assembly and manufacturing method, wherein themolded base forms a sloped light window, which increases light flux andmeets the requirements of the field of view and angular incidence of thephotosensitive element.

Another advantage of the invention is to provide a camera module and itsmolded circuit board assembly and manufacturing method, wherein each ofthe demoulding angles is provided with a predetermined angular range,thereby securing the structural strength and the light reflectance ofthe molded base and reducing demould friction.

Additional advantages and features of the invention will become apparentfrom the description which follows, and may be realized by means of theinstrumentalities and combinations particular point out in the appendedclaims.

According to the present invention, the foregoing and other objects andadvantages are attained by a molded circuit board assembly for a cameramodule, which comprises at least one circuit board and at least onemolded base integrally formed with the circuit board through a moldingprocess, wherein the molded base forms at least one light window whichprovides a light path for a photosensitive element of the camera module,and at least one portion of an inner side surface of the molded basewhich is integrally extended form the circuit board is aslant extended.

In some embodiments, an included angle of the portion of the inner sidesurface of the molded base and an optical axis line direction of thecamera module has a predetermined range of 3°˜30°.

In some embodiments, the molded base has an inner side surface which islinearly extended from the circuit board, so that the overall inner sidesurface of the molded base is aslant extended, and the inner sidesurface of the molded base and an optical axis line direction of thecamera module define an inclination angle α which is convenient fordemoulding and is capable of avoiding stray lights, wherein a range ofthe inclination angle α is 3°˜30°; a numerical value range of theinclination angle α is selected from a group consisting of 3°˜15°,15°˜20°, and 20°˜30°.

In some embodiments, the molded base has an outer side surface which isintegrally and flatly extended from the circuit board, wherein the outerside surface of the molded base and an optical axis line direction ofthe camera module have an inclination angle γ which is convenient fordemoulding, wherein a range of the inclination angle γ is 3°˜45°; anumerical value range of the inclination angle γ is selected from agroup consisting of 3°˜15°, 15°˜30° and 30°˜45°.

In some embodiments, a top groove is formed on a top end of the moldedbase, and the molded base has a curved extending inner surfacecomprising a first portion inner side surface, a second portion innerside surface and a third portion inner side surface, which aresuccessively and integrally extended, wherein the first portion innerside surface is integrally and aslant extended from the circuit board,and the third portion inner side surface is integrally and aslantextended from the second portion inner side surface, wherein the secondportion inner side surface and the third portion inner side surfacedefine the top groove.

In some embodiments, the first portion inner side surface of the moldedbase and an optical axis line direction of the camera module form aninclination angle α which is convenient for demoulding and is capable ofavoiding stray lights, wherein a range of the inclination angle α is3°˜30°, wherein the third portion inner side surface of the molded baseand the optical axis line direction of the camera module define aninclination angle β which is convenient for demoulding and is capable ofavoiding stray lights, wherein a range of the inclination angle β is3°˜30°.

In some embodiments, a numerical value range of the inclination angle αis selected from a group consisting of 3°˜15°, 15°˜20°, and 20°˜30°,wherein a numerical value range of the inclination angle β is selectedfrom a group consisting of 3°˜15°, 15°˜20° and 20°˜30°.

In some embodiments, the second portion inner side surface of the moldedbase is parallel to the top surface of the photosensitive element.

In some embodiments, the molded base has an outer side surface which isflatly extended from the circuit board, wherein the outer side surfaceof the molded base comprises a plurality of outer peripheral surfacesarranged along an outer peripheral direction of the molded base, whereinat least one outer side surface of the molded base and the optical axisline direction of the camera module define an inclination angle γ whichis convenient for demoulding, wherein a range of the inclination angle γis 3° ˜45°; a numerical value range of the inclination angle γ isselected from a group consisting of 3°˜15°, 15°˜30° and 30°˜45°.

In some embodiments, the circuit board comprises a base board and a setof electronic components, wherein the molded base encloses theelectronic components.

In some embodiments, the molded circuit board assembly further comprisesone or more lens actuator pin grooves, wherein a pin groove wall formingeach of the lens actuator pin grooves and the optical axis linedirection of the camera module define an inclination angle δ forfacilitating demoulding, wherein a range of the inclination angle δ is3°˜30°.

In some embodiments, at an outer side of at least one outer peripheralsurface of the outer side surface of the molded base, a base board ofthe circuit board has a press-fit distance W which is convenient topress-fit for at least one dividing block of a molding mould in themolding process, wherein a numerical value range of the press-fitdistance W is 0.1˜0.6 mm.

In some embodiments, a reflectivity of a material surface of the moldedbase is less than 5% in the wavelength range of 435-660 nm.

According to the present invention, the foregoing and other objects andadvantages are also attained by a camera module, comprising at least onelens, at least one photosensitive element, and at least one moldedcircuit board assembly, wherein the molded circuit board assemblycomprises at least one circuit board and at least one molded baseintegrally formed with the circuit board through a molding process,wherein the molded base forms at least one light window which provides alight path for the photosensitive element and the lens, wherein at leastone portion of an inner side surface of the molded base integrallyextended form the circuit board is aslant extended for easy demouldingin the molding process.

In some embodiments, the camera module further comprises at least oneoptical filter installed on a top end of the molded base.

In some embodiments, the camera module further comprises at least oneoptical filter installed in the top groove of the molded base.

In some embodiments, the camera module further comprises at least oneoptical filter holder and at least one optical filter, wherein theoptical filter is mounted on the optical filter holder and the opticalfilter holder is mounted on a top end of the molded base.

In some embodiments, the camera module further comprises at least oneoptical filter holder and at least one optical filter, wherein theoptical filter is mounted on the optical filter holder and the opticalfilter holder is mounted in the top groove of the molded base.

In some embodiments, the camera module further comprises at least onelens actuator mounted on a top side of the molded base such that themolded base supports the lens actuator, wherein the lens is installed inthe lens actuator to perform automatic focusing.

In some embodiments, a plurality of the camera modules is assembled intoa cameral module array.

In some embodiments, the molded circuit board assembly comprises aplurality of the light windows so as to form a cameral module array witha plurality of the lenses.

According to the present invention, the foregoing and other objects andadvantages are also attained by an electronic device comprising one ormore the camera modules and the electronic device can be, but notlimited to, a mobile phone, a computer, a television, an intelligentwearable equipment, a transportation tool, a camera, or a monitoringdevice.

According to the present invention, the foregoing and other objects andadvantages are also attained by a molding mould, for manufacturing atleast one molded circuit board assembly of a camera module, comprising afirst mould and a second mound, wherein when the first mould and thesecond mound are closed to form at least a molding chamber therein, andat least one light window forming block and a base forming guide groovedisposed around the light window forming block are provided in themolding chamber of the molding mould, wherein when at least one circuitboard is placed in the molding chamber, a molding material filled in thebase forming guide groove is solidified from a liquid state to a solidstate under temperature control, wherein a molded base is formed at aposition corresponding to the base forming guide groove and a lightwindow of the molded base is formed at a position corresponding to thelight window forming block, wherein the molded base is integrally moldedon the circuit board so as to form the molded circuit board assembly ofthe camera module.

In some embodiments, a base inner side surface forming surface is aslantextended along an outer peripheral region of the light window formingblock to form an integrally and lineally extending inner side surface ofthe molded base.

In some embodiments, an inclination angle α is formed at the base innerside surface forming surface of the light window forming block withrespect to a vertical line direction of the camera module forfacilitating mould release, has a range of 3°˜30°.

In some embodiments, the light window forming block comprises a presshead portion and a groove forming portion integrally extended from thegroove forming portion, wherein the groove forming portion has a largerdiameter than the press head portion to form a top groove on a top sideof the molded base.

In some embodiments, an outer side surface of the press head portionalong an outer peripheral region of the press head portion and thevertical line direction have an inclination angle α for facilitatingdemoulding and avoiding stray lights, wherein a range of the inclinationangle α is 10°˜80°, wherein an outer side surface of the groove formingportion and the vertical line direction define an inclination angle β,wherein a range of the inclination angle β is 30˜30°.

In some embodiments, the first mould comprises at least one divisionblock having a base outer side surface forming surface, wherein the baseouter side surface forming surface and the vertical line directiondefine an inclination angle γ for facilitating demoulding and avoidingstray lights, wherein a range of the inclination angle γ is 3°˜45°.

Still further objects and advantages will become apparent from aconsideration of the ensuing description and drawings.

These and other objectives, features, and advantages of the presentinvention will become apparent from the following detailed description,the accompanying drawings, and the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic view of a conventional molded photosensitiveassembly manufactured by a conventional encapsulating technology.

FIG. 1B is a schematic view of a conventional forming process formanufacturing the conventional encapsulated photosensitive assembly.

FIG. 1C is a schematic view of a demouding process in the conventionalencapsulating process for manufacturing the conventional encapsulatedphotosensitive assembly.

FIG. 1D is a schematic view illustrating a light path of a camera modulepackaged by a conventional COB technology.

FIG. 1E is a schematic view illustrating a light path of a camera moduleby a conventional integrally packaging technology.

FIG. 2 is a schematic diagram of a molded circuit board assembly of acamera module according to a first preferred embodiment of the presentinvention.

FIG. 3A is an exploded perspective view of the camera module accordingto the above first preferred embodiment of the present invention.

FIG. 3B is a cross-sectional view of the camera module along a lengthdirection according to the above first preferred embodiment of thepresent invention.

FIG. 4 is a perspective view of the molded circuit board assemblyaccording to the above first preferred embodiment of the presentinvention.

FIG. 5 is a cross-sectional view illustrating the molding mould of thecamera module according to the above first preferred embodiment of thepresent invention along an A-A line of FIG. 4.

FIG. 6 is a partial enlarged schematic view illustrating an inclinationangle for facilitating demoulding of the camera module according to theabove first preferred embodiment of the present invention.

FIG. 7 is a schematic view illustrating the avoiding stray lights of thecamera module according to the above first preferred embodiment of thepresent invention.

FIG. 8A is a cross-sectional view of the molded circuit board assemblyaccording to the above preferred embodiment of the present invention,illustrating that a liquid molding material is pushed into a baseforming guide groove by a molding mould; the cross-sectional view isalong an A-A line of the FIG. 4.

FIG. 8B is a cross-sectional view of the molded circuit board assemblyaccording to the above preferred embodiment of the present invention,illustrating that the molding mould of a manufacturing equipmentperforms the molding process to form a molded base; the cross-sectionalview is along the A-A line of the FIG. 4.

FIG. 9 is a schematic view illustrating a demoulding process of themolded circuit board assembly according to the above first preferredembodiment of the present invention.

FIG. 10 is an exploded perspective view of the molded circuit boardassembly according to a second preferred embodiment of the presentinvention.

FIG. 11 is a cross-sectional view of the camera module along a lengthdirection according to the above second preferred embodiment of thepresent invention.

FIG. 12 is a cross-sectional view of the camera module according to analternative mode of the above second preferred embodiment of the presentinvention.

FIG. 13 is a perspective view of molded circuit board assembly of thecamera module assembled according to the above second preferredembodiment of the present invention.

FIG. 14 is a cross-sectional view of the molding mould of the cameramodule according to the above second preferred embodiment of the presentinvention along a C-C line of FIG. 13.

FIG. 15 is a partial enlarged schematic view illustrating an inclinationangle for facilitating demoulding of the camera module according to theabove second preferred embodiment of the present invention.

FIG. 16 is a cross-sectional view of the molded circuit board assemblyaccording to the above second preferred embodiment of the presentinvention, illustrating that a liquid molding material is pushed into abase forming guide groove by a molding mould; the cross-sectional viewis along a C-C line of the FIG. 13.

FIG. 17 is a cross-sectional view of the molded circuit board assemblyaccording to the above second preferred embodiment of the presentinvention, illustrating that a liquid molding material is pushed intothe base forming guide groove by the molding mould; the cross-sectionalview is along the C-C line of the FIG. 13.

FIG. 18 is a cross-sectional view of the molded circuit board assemblyaccording to the above second preferred embodiment of the presentinvention, illustrating that the molding mould performs the moldingprocess to form an integral piece of molded bases array, wherein thecross-sectional view is along an E-E line of the FIG. 13.

FIG. 19 is a schematic view of a demoulding process of the moldedcircuit board assembly according to the above second preferredembodiment of the present invention.

FIG. 20 is a perspective view of an integral piece of molded circuitboard assembly array manufactured by the molding process according tothe above second preferred embodiment of the present invention.

FIG. 21 is a schematic view of a separated molded circuit board assemblycut down from the integral piece of molded circuit board assembly arrayin the molding process according to the above second preferredembodiment of the present invention.

FIG. 22 is a cross-sectional view of a molded circuit board assemblyaccording to an alternative mode of the above second preferredembodiment of the present invention.

FIG. 23 is a cross-sectional view of a molded circuit board assemblyaccording to an alternative mode of the above second preferredembodiment of the present invention.

FIG. 24 is a cross-sectional view of a molded circuit board assemblyaccording to an alternative mode of the above second preferredembodiment of the present invention.

FIG. 25 is a schematic view illustrating the above camera module appliedon a mobile phone according to the above embodiment of the presentinvention.

FIG. 26 is a partial enlarged schematic view illustrating an inclinationangle for facilitating demoulding of the molded circuit board assemblymanufactured by the molding process according to a first example of theabove second embodiment of the present invention.

FIG. 27 is a partial enlarged schematic view illustrating an inclinationangle for facilitating demoulding of the molded circuit board assemblymanufactured by the molding process according to a second example of theabove second embodiment of the present invention.

FIG. 28 is a partial enlarged schematic view illustrating an inclinationangle for facilitating demoulding of the molded circuit board assemblymanufactured by the molding process according to a third example of theabove second embodiment of the present invention.

FIG. 29 is a partial enlarged schematic view illustrating an inclinationangle for facilitating demoulding of the molded circuit board assemblymanufactured by the molding process according to a fourth example of theabove second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The following description is disclosed to enable any person skilled inthe art to make and use the present invention. Preferred embodiments areprovided in the following description only as examples and modificationswill be apparent to those skilled in the art. The general principlesdefined in the following description would be applied to otherembodiments, alternatives, modifications, equivalents, and applicationswithout departing from the spirit and scope of the present invention.

Those skilled in the art should understand that, in the disclosure ofthe present invention, terminologies of “longitudinal,” “lateral,”“upper,” “front,” “back,” “left,” “right,” “perpendicular,”“horizontal,” “top,” “bottom,” “inner,” “outer,” and etc. that indicaterelations of directions or positions are based on the relations ofdirections or positions shown in the appended drawings, which are onlyto facilitate descriptions of the present invention and to simplify thedescriptions, rather than to indicate or imply that the referred deviceor element is limited to the specific direction or to be operated orconfigured in the specific direction. Therefore, the above mentionedterminologies shall not be interpreted as confine to the presentinvention.

It is understandable that the term “a” or “an” should be understood as“at least one” or “one or more”. In other words, in some embodiments,the number of an element can be one and in other embodiment the numberof the element can be more than one. The term “a” or “an” is notconstrued as a limitation of quantity.

Referring to FIG. 2 to FIG. 9 of the drawings, a camera module 100according to a first preferred embodiment of the present invention isillustrated. The camera module 100 can be applied to various electronicdevices, such as smart phones, wearable devices, computer equipment,televisions, vehicles, cameras, monitoring devices, and etc. Theelectronic devices disclosed above are exemplary only and not intendedto be limiting. The camera module 100 is cooperated with the electronicdevices to perform image acquisition and reproduction of a targetobject.

More specifically, a molded circuit board assembly 10 of the cameramodule 100 and a manufacturing equipment 200 for the camera module 100are illustrated according to the first preferred embodiment of thepresent invention. The molded circuit board assembly 10 comprises acircuit board 11 and a molded base 12. Wherein the molded base 12 of thepresent invention is integrally packaged and molded on the circuit board11 by the manufacturing equipment 200, so that the molded base 12 iscapable of replacing a conventional holder or a support of aconventional cameral module, and it is unlike a conventional packagingprocess which is required to adhere the holder or the support to thecircuit board by glue.

The camera module 100 further comprises at least a lens 30 and at leasta photosensitive element 13. Wherein the molded base 12 comprises anannular molding body 121 and has a light window 122 in a middle portionthereof to provide a light path for the lens 30 and the photosensitiveelement 13. The photosensitive element 13 is operatively connected tothe circuit board 11. For example, the photosensitive element 13 isconnected to the circuit board 11 by connecting elements such as leadwires 15 through a COB (Chip on Board) process, and the photosensitiveelement 13 is positioned on a top side of the circuit board 11. Thephotosensitive element 13 and the lens 30 are respectively assembled ontwo sides of the molded base 12 and are optical aligned in such a mannerthat the light passing through the lens 30 is able to reach thephotosensitive element 13 via the light window 122, so that the cameramodule 100 is able to provide an optical image through photoelectricconversion.

As shown in FIG. 3A and FIG. 3B of the drawings, the camera module 100can be an automatic-focus camera module which further comprises a lensactuator 40 such as a voice coil motor and a piezoelectric motor, thelens 30 is installed in the lens actuator 40. The molded base 12 iscapable of supporting the lens actuator 40. An optical filter 50 isprovided on a top side of the molded base 12 to filter light whichpasses through the lens 30 and the optical filter 50 can be an infraredcut-off filter. The automatic-focus camera module in this embodiment ofthe present invention as shown in the drawings and described above isexemplary only and not intended to be limiting. In other embodiment ofthe present invention, the lens 30 can be installed at the moldedcircuit board assembly 10 without the need of the lens actuator 40. Inother words, the camera module 100 can be a fixed focus camera module,one skilled in the art would understand that the type of the cameralmodule is not intended to be limiting and the camera module 100 can be afixed focus camera module or an automatic-focus camera module.

The circuit board 11 comprises a base board 111 and a plurality ofelectronic components 112. The plurality of electronic components 112 isformed on the base board 111 using a technology such as the surfacemount technology, SMT. The electronic components 112 include but are notlimited to resistors, capacitors, and other device drivers. In thisembodiment of the invention, the molded base 12 is integrally molded toenclose the electronic components 112 to prevent objects such as dustsand debris of a conventional camera module from adhering to theelectronic components 112 to further contaminate and pollute thephotosensitive element 13 that adversely affects the imaging results. Itis understandable that in another alternative mode of the embodiment theelectronic components 112 is embedded in the base board 111, in otherwords, the electronic components 112 are not exposed to outside. Thebase board 111 of the circuit board 11 can be a rigid PCB, a flexiblePCB, a rigid-flex PCB, or a ceramic substrate. It is worth mentioningthat, in this preferred embodiment of the present invention, since themolded base 12 is integrally coated on the electronic components 112,the electronic components 112 are able to be not embedded within thebase board 111. The base board 111 is merely used to form electricconductive lines, so that the finally obtained molded circuit boardassembly 10 may have a smaller thickness.

In this preferred embodiment of the present invention, thephotosensitive element 13 is overlappedly installed on a flatoverlapping region of the circuit board 11, where is located at an innerside of the electronic components 112. The photosensitive element 13 hasa top surface 131 which has a photosensitive area portion 1311 in thecenter and a non-photosensitive area portion 1312 around thephotosensitive area portion 1311. The photosensitive element 13 iselectrically conducted to the circuit board 11 by one or more electricalconnecting elements such as lead wires 15. More specifically, thephotosensitive element 13 has a photosensitive element connecting pad132 and the circuit board 11 has a circuit board connecting pad 113. Twoends of each of the lead wires 15 are respectively connected to thephotosensitive element connecting pad 132 and the circuit boardconnecting pad 113.

Furthermore, as shown in FIG. 2 of the drawing, the manufacturingequipment 200 for the molded circuit board assembly 10 of the cameramodule 100 comprises a molding mould 210, a molding material feedingmechanism 220, a mould fixing unit 230, a temperature control unit 250,and a controller 260. A molding material 14 is placed within, or fedinto by the molding material feeding mechanism 220, a base forming guidegroove 215 of the molding mould 210. The mould fixing unit 230 controlsthe mould closing and mould releasing, i.e. an opened-mould position anda closed-mould position, of the molding mould 210. The temperaturecontrol unit 250 heats up or cools down the molding material 14. Thecontroller 260 automatically controls operations of the molding materialfeeding mechanism 220, the mould fixing unit 230 and the temperaturecontrol unit 250 in the molding process.

The molding mould 210 comprises a first mould 211 and a second mould212. The first mould 211 and the second mould 212 are able to be openedfrom each other and to be closed together to form a moulding chamber 213therein under control of the mould fixing unit 230. In other words, themould fixing unit 230 is able to separate the first mould 211 and thesecond mould 212 from each other and to close the first mould 211 andthe second mould 212 together to define the molding chamber 213 therein.When the molding mould 210 is in the closed-mould position, the circuitboard 11 is set within the molding chamber 213 and the liquid moldingmaterial 14 entered into the molding chamber 213 will integrally mold onthe circuit board 11 to from the molded base 12, which will beintegrally molded on the circuit board 11 after solidification.

More specifically, the molding mould 210 further comprises a lightwindow forming block 214 and the base forming guide groove 215 formedaround the light window forming block 214. When the first mould 211 andthe second mould 212 are in the closed-mould position, the light windowforming block 214 and the base forming guide groove 215 are extendedinside of the molding chamber 213 and the liquid molding material 14 isfilled into the base forming guide groove 215, as the positioncorresponding to the light window forming block 214 cannot be filledwith the liquid molding material 14, so that the liquid molding material14 forms the annular molding body 121 of the molded base 12 at theposition of the base forming guide groove 215 and the light window 122of the molded base 12 is formed at the position of the light windowforming block 214 after solidification. The molding material 14 can beselected from nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene),epoxy resin, and the like. One skilled in the art should understand thatthe material of the molding material 14 described above is exemplaryonly and not intended to be limiting.

The first mould 211 and the second mould 212 can be two moulds having arelative movement with each other. For example, one of the two moulds isstationary and the other of the two moulds is moveable. Alternatively,both of the two mounds are moveable, the present invention in thisaspect described above is exemplary only and not intended to belimiting. In this embodiment of the present invention, the first mould211 is specifically embodied as a fixed upper mould and the second mould212 is specifically embodied as a moveable lower mould. The fixed uppermould and the moveable lower mould are provided coaxially. For example,the moveable lower mould can slide upwardly along a plurality ofpositioning shafts and can form the closed molding chamber 213 with thefixed upper mould in the closed-mould position.

The second mould 212 which is embodied as the lower mould has a circuitboard positioning groove 2121. The circuit board positioning groove 2121has a groove shape or is formed by a plurality of positioning posts formounting and setting the circuit board 11 in position. The light windowforming block 214 and the base forming guide groove 215 can be formed inthe first mould 211 which is embodied as the upper mould. When the firstmould 211 and the second mould 212 are in the closed-mould position, themolding chamber 213 is defined, and the liquid molding material 14 isfilled into the base forming guide groove 215 at a top side of thecircuit board 11, so that the molded base 12 is formed on the circuitboard 11 and the top side of the photosensitive element 13.

It is understandable that the circuit board positioning groove 2121 alsocan be provided in the first mould 211 which is embodied as the uppermould adapted for mounting and setting the circuit board 11 in position.The light window forming block 214 and the base forming guide groove 215can be formed in the first mould 211. When the first mould 211 and thesecond mould 212 are in the closed-mould position, the molding chamber213 is defined. The circuit board 11 in the upper mound is arrangedtoward an obverse side and the liquid molding material 14 is filled intothe base forming guide groove 215 which is on a bottom side of theinverted circuit board 11, so that the molded base 12 is formed on thebottom side of the inverted circuit board 11.

More specifically, when the first mould 211 and the second mould 212 arein the closed-mould position and perform the molding process, the lightwindow forming block 214 is overlappedly and tightly positioned on thecircuit board 11, so that the liquid form molding material 14 is blockedfrom entering the top surface 131 of the photosensitive area 1311 of thephotosensitive element 13 and thus the light window 122 of the moldedbase 12 is formed corresponding to the position of the light windowforming block 214.

It is understandable that, a molding surface of the first mould 211forming the base forming guide groove 215 can be configured as a flatsurface and in a same plane. Thus, when the molded base 12 is formedafter solidification, a top surface of the molded base 12 is relativelysmooth and flat, so that the molded base 12 provides a flat mountingcondition for the lens 30 or other supporting components of the lens 30,thereby reducing a tilt error of the assembled camera module 100.

It is worth mentioning that the base forming guide groove 215 and thelight window forming block 214 can be integrally molded on the firstmould 211. In other words, the first mould 211 further comprises adetachable molding configuration, the molding configuration is formedwith the base forming guide groove 215 and the light window formingblock 214. Thus, different shapes and sizes of the base forming guidegroove 215 and the light window forming block 214 are designed accordingto different shapes and sizes of the molded circuit board assembly 10such as with different diameters and thickness of the molded base. Thus,as long as replacing different molding configuration, the manufacturingequipment is adapted to be applied on different specificationrequirements of the molded circuit board assembly 10. It isunderstandable that the second mould 212 correspondingly comprises adetachable fixed block to provide different shapes and sizes of thecircuit board positioning groove 2121 so as to facilitate thereplacement of different shapes and sizes of the circuit board 11.

It is understandable that the molding material 14 is a thermal fusiblematerial such as a thermoplastic material. A melting and heating deviceturns the solid-state heat fusible material into the liquid form moldingmaterial 14 by heating and melting. During the molding process, the hotmelted molding material 14 is solidified by a cooling process. Themolding material 14 can also be a thermosetting material. Thethermosetting material is heated and melt to turn into the liquid formmolding material 14 by the melting and heating device. During themolding process, the thermosetting molding material 14 is solidified bya further heating process, and the molding material 14 cannot be meltedagain after solidification, thereby forming the molded base 12.

It is understandable that in the molding process of the presentinvention, the molding material 14 can be in form of blocks, pellets, orpowder, which becomes liquid in the molding mould 210 after heating andis then cured to form the molded base 12 after solidification.

It is understandable that, in this embodiment, a molding process of thecircuit board 11 is illustrated, and in the application of themanufacturing equipment 200, a plurality of independent circuit boards11 can be molded at a same time. Alternatively, a joint board arrayoperation is also adapted to be used as mentioned in the followingsecond preferred embodiment.

Referring to FIG. 8A to FIG. 9 of the drawings, a manufacturing processof the molded circuit board assembly 10 of the camera module 100according to the preferred embodiment of the present invention isillustrated. As shown in FIG. 8A of the drawings, the molding mould 210is in the closed-mould position, and the circuit board 11 which is aboutto be molded and the solid molding material 14 are set in position. Thesolid molding material 14 is heated to melt into a liquid state or intoa semi-solid state and filled into the base forming guide groove 215until reaching a surrounding portion of the light window forming block214.

As shown in FIG. 8B of the drawings, after the base forming guide groove215 is filled with the liquid form molding material 14, the liquidmolding material 14 is solidified to form the molded base 12 which isintegrally formed on the circuit board 11. Taking the molding material14 being embodied as a thermosetting material as an example, the heatedand melted liquid form molding material 14 will be solidified to formthe molded base 12 after being additional heated.

As shown in FIG. 9 of the drawings, after the molding material 14 issolidified and cured to form the molded base 12, a demoulding process isperformed. In the demoulding process, the first mould 211 and the secondmould 212 are moved away from each other by the mould fixing unit 230,and thus the light window forming block 214 is departed from the moldedbase 12 and the light window 122 is formed in the molded base 12.

In the conventional art, as shown in FIG. 1B of the drawings, a bottomof a square-shaped molding block 4 has a sharp edge. During a demouldingprocess, the sharp edge generates a relatively large friction with theinner surface of an encapsulation portion 1, which will deform anddamage the inner surface of the encapsulation portion 1. However,according to the present invention, the light window forming block 214of the present invention is configured that the molded base 12 will notbe deformed and damaged.

More specifically, in the preferred embodiment of the present invention,as shown in FIG. 8A to FIG. 9 of the drawings, the light window formingblock 214 is made to have a taper shape in cross section. In otherwords, the light window forming block 214 has a pyramidal shape such asa truncated cone shape, and the interior of the light window formingblock 214 is in solid form or is constructed to have a hollow form. Inother words, it likes a hollow cover adapted to cover on top of thecircuit board or the photosensitive element 13 electrically connectedwith the circuit board 11 in order to facilitate the subsequent moldingprocess.

In this embodiment of the present invention, the light window formingblock 214 is a solid structure. The light window forming block 214 has apress-fit surface 2141 on the bottom side thereof and a base inner sidesurface forming surface 2142 formed by a peripheral molding surfaceflatly and inwardly extended along a circumferential direction of thepress-fit surface 2141. The included angle between the base inner sidesurface forming surface 2142 and a vertical line is defined as a firstinclination angle α, which is an acute angle rather than the 0 degreeconventional included angle. More specifically, the first inclinationangle α is ranged preferably from 10° to 80°, and more preferably 30° to55°.

It is understandable that as shown in FIG. 5 and FIG. 6 of the drawings,the annular molding body 121 of the molded base 12 of the molded circuitboard assembly 10 of the camera module 100 has a flatly extended innerside surface 124. Between the inner side surface 124 and a straight linedirection of the optical axis Y of the photosensitive element 13 of themolded circuit board assembly 10, an included angle is defined, which isthe same as the first inclination angle α.

As shown in FIG. 8A of the drawings, the light window forming block 214has a trapezoidal cross section which gradually increases from thebottom to the top. Accordingly, the light window 122 formed in themolded base 12 has a trapezoidal cross section which gradually increasesfrom the bottom to the top. The size range of the first inclinationangle α is preferably to 10° to 80°, and more preferably is 30° to 55°so as to facilitate demoulding without damaging the lead wires 15. Inaddition, the light window 122 of the molded base 12 having atrapezoidal cross section can save molding material and ensure itsstrength.

It is worth mentioning that it is also possible to effectively avoid thestray light by selecting the size range of the first included angle αaccording to the present invention. As shown in FIG. 1E of the drawings,according to a conventional molded and packaged camera module, theincident light through a lens has a portion reaching a photosensitivechip for photosensitive effect, and another portion, such as the lightas shown in FIG. 1D, projecting onto the vertical inner walls of anencapsulation portion 1, which is easily reflected by the inner walls ofthe encapsulation portion 1 as reflected stray light to reach thephotosensitive chip 3 to process the photoelectric conversion of thephotosensitive chip 3, that adversely affect the imaging quality of theconventional cameral module. However, according to the preferredembodiment of the present invention, as shown in FIG. 7 of the drawings,the incident light from the lens 30 has a portion reaching thephotosensitive element 13 and another portion, such as the light in thesame direction of light in FIG. 1D, projecting onto the inner sidesurface 124 of the molded base 12 and being reflected by the inner sidesurface 124 of the molded base 12, wherein the reflected light isdistant from the photosensitive element 13 without reaching thephotosensitive element 13 to avoid being processed in the photoelectricconversion process of the photosensitive element 13, so as to reduce theadverse influence of reflected stray light on the imaging quality of thecamera module 100.

It is worth mentioning that in the embodiment of the present invention,the material surface of the molded base 12 has a reflectivity of lessthan 5% in the wavelength range of 435-660 nm. In other words, most ofthe incident light on the surface of the molded base 12 cannot bereflected to form the interference stray light reaching thephotosensitive element 13, thereby remarkably reducing the adverseinfluence of reflected stray light.

In addition, as shown in the drawings, the molded base 12 has the innerside surface 124 extended along an inner circumferential directionthereof, an outer side surface 125 extended along an outercircumferential direction thereof, and an annular top side surface 126.The inner side surface 124 is extended integrally from the base board111 of the circuit board 11. The outer side surface 125 is also extendedintegrally from the base board 111 of the circuit board 11. The firstmould 211 of the molding mould 210 is further provided with one or moredividing blocks 216 for forming the outer side surface 125 of the moldedbase 12 during the molding process. More specifically, the dividingblocks 216 has a base outer side surface forming surface 2161 todetermine a position and shape of the outer side surface 125 of themolded base 12 which is formed by the molding material 14 aftersolidification in the molding process. A top-side molding surface 217 isformed between the dividing blocks 216 and the light window formingblock 214 to determine a position and shape of the top side surface 126of the molded base 12 which is formed by the molding material 14 aftersolidification in the molding process. In the conventional art, theouter surface of the encapsulation portion 1 is perpendicular to acircuit board. In other words, a base outer surface molding surface of apartition block of the conventional mould is vertically oriented, sothat during the demoulding process, the base outer surface moldingsurface of the partition block of the conventional mould is rubbedagainst the encapsulation portion 1, so that the demoulding process isinconvenient to operate, and the outer side surface of the encapsulationportion 1 is easily damaged.

However, according to the embodiment of the present invention, the baseouter side surface forming surface 2161 has a second inclination angle γwith respect to a vertical direction. Therefore, the same inclinationangle γ is defined between the outer side surface 125 of the molded base12 with respect to the optical axis Y direction. In other words, whenthe molded base 12 is horizontally arranged, the outer side surface 125of the molded base 12 has the second inclination angle γ with respect toa vertical line. In order to facilitate demoulding, the secondinclination angle γ is an acute angle and should not be too largebecause the top side surface 126 of the molded base 12 is needed to havea sufficient size to facilitate the subsequent installment of lens 30 orlens actuator 40. In other words, if the second inclination angle γ istoo large and the inner side surface 124 and the outer side surface 125of the molded base 12 are both in inclined shape, the length of the topside surface 126 becomes too small to securely install the lens 30 orthe lens actuator 40. In addition, in this embodiment, the bottomportion of the lens actuator 40 has a mating surface fitting to the topside surface 126 of the molded base 12. When the top side surface 126 ofthe molded base 12 has a too small dimension, for example, less than themating surface, it is inconvenient for alignment of the lens actuator40. When the lens actuator 40 is mounted on the top side surface 126 ofthe molded base 12, the lens actuator 40 may be shaken and not stable,and the lens actuator 40 cannot be prevented from crashing andanti-collision. Accordingly, in a preferred embodiment of the presentinvention, the numerical maximum of the first inclination angle α ispreferably not more than 30° and the numerical maximum of the secondinclination angle γ is preferably not more than 45°. In addition, in anumerical minimum of the second inclination angle γ, the demouldingoperation of the molding process can be facilitated and themanufacturing of the molding mould 210 can also be facilitated.Therefore, the numerical minimum of the first inclination angle α andthe second inclination angle γ is preferably not smaller than 3°.Therefore, the range of the first inclination angle α of the presentinvention is suitably 3° to 30°, more preferably 3° to 15°. The range ofthe second inclination angle γ of the present invention is suitably 3°to 45°, more preferably 3° to 15°. It is worth mentioning that, as shownin FIG. 5 of the drawings, a press-fit distance W is formed on an outeredge of the base board 111 of the circuit board 11 and the outer sidesurface 125 of the formed molded base 12, so that it is facilitate todemould and to press-fit the base board 111 of the circuit board 11. Inother words, in the molding process, the dividing blocks 216 is suitableto press-fit on the region of the base board 111 of the circuit board11, the press-fit distance W is a distance from a position which is theouter side surface 125 of the molded base 12 extended from the baseboard 111 of the circuit board 11 to the outer edge of the base board111 of the circuit board 11. For example, the press-fit distance W has arange of 0.1˜0.6 mm. In a specific example, the press-fit distance W is0.2 mm.

It is understandable that, due to the ranging of the first inclinationangle α and the second inclination angle γ, that is the inner sidesurface 124 and the outer side surface 125 of the molded base 12 havinginclinations, during the demoulding process, the molded base 12 and thefirst mould 211 have a reduced friction and the molded base 12 is easyto be drafted out in such a manner that the molded base 12 has a bettermolding state. More specifically, when the molded base 12 is cured andformed after solidification in the molding process and in the demouldingprocess, the light window forming block 214 and the dividing blocks 216begin to move vertically and upwardly, the base inner side surfaceforming surface 2142 of the light window forming block 214 and the baseouter side surface forming surface 2161 of the dividing blocks 216 arerespectively separated with the inner side surface 124 of the moldedbase 12 and the outer side surface 125 of the molded base 12, so thatthe base inner side surface forming surface 2142 of the light windowforming block 214 and the base outer side surface forming surface 2161of the dividing blocks 216 are not in friction contact with the innerside surface 124 of the molded base 12 and the outer side surface 125 ofthe molded base 12 respectively, thereby avoiding deforming and damagingthe inner side surface 124 and the outer side surface 125 of the moldedbase 12 and at the same time facilitating a smooth drafting of themolded base 12.

At the same time, the shape of the base forming guide groove 215 formedby the molding mould 210 is at a suitable gradient without aright-angled corner in such a manner that the liquid form moldingmaterial 14 entering in the base forming guide groove 215 has a betterliquidity. Furthermore, the first inclination angle α and the secondinclination angle γ are acute angles, unlike the right-angle in theconventional art, so that the angle of the top surface 131 of thephotosensitive element 13 of the molded circuit board assembly 10 andthe inner side surface 124 of the molded base 12 becomes a relativelyrounded obtuse angle. The light window forming block 214 and thedividing blocks 216 do not form sharp edges and corners to scratch theinner side surface 124 and the outer side surface 125 of the molded base12. In addition, the first inclination angle α of the present inventionenables the molded base 12 preventing the stray light from affecting theimage quality of the camera module 100.

Referring to FIG. 10 to FIG. 21 of the drawings, the molded circuitboard assembly 10 of the camera module 100 and the manufacturing processthereof according to a second preferred embodiment of the presentinvention are illustrated. In this embodiment of the present invention,an integral piece of molded circuit board assembly array 1000 ismanufactured by a joint board array operation, and the molded circuitboard assembly 10 is obtained by cutting the integral piece of moldedcircuit board assembly array 1000.

Accordingly, more specifically, the molding chamber 213 is formed whenthe molding mould 210 is in the closed-mould position, and a pluralityof the light window forming blocks 214 and one or more integral basearray forming guide grooves 2150 are provided. In other words, aplurality of the base forming guide grooves 215 communicated with eachother is provided and these base forming guide grooves 215 form anoverall guiding groove.

Before the molding process, an integral piece of circuit board array1100 is manufactured in advance. The integral piece of circuit boardarray 1100 comprises a plurality of circuit boards 11 integrallyconnected with each other.

When the integral piece of circuit board array 1100 is placed in themolding chamber 213 and the molding mould 210 is in the closed-mouldposition, the solid molding material 14 is heated to melt and istransported to enter the integral base array forming guide groove 2150,thereby the liquid molding material 14 is filled around each of thelight window forming blocks 214. Finally, during a solidifying process,the liquid molding material 14 in the integral base array forming guidegroove 2150 is solidified and hardened to form the molded base 12 whichis integrally molded on each of the circuit boards 11 of the integralpiece of circuit board array 1100. These molded bases 12 form an overallintegral piece of molded base array 1200.

The molding surface of the first mould 211 contacted with the circuitboard 11 is also provided with an elastic film layer 219, so that themolding surface of the first mould 211 is firmly contacted with thecircuit board 11 and is more convenient for demoulding.

It is worth mentioning that, when each of the separated molded circuitboard assembly 10 manufactured by cutting the integral piece of moldedcircuit board assembly array 1000 to manufacture the auto-focus cameralmodule, the molding mould 210 further comprises a plurality of lensactuator pin groove forming blocks 218. Each of the lens actuator pingroove forming blocks 218 is extended in the integral base array formingguide groove 2150, so that in the molding process, the liquid moldingmaterial 14 is not filled at the positions corresponding to the lensactuator pin groove forming blocks 218, so that after the solidifyingstep, a plurality of the light windows 122 and a plurality of the lensactuator pin grooves 127 are formed in the integral piece of molded basearray 1200 of the integral piece of molded circuit board assembly array1000, and the molded base 12 of each of the separated molded circuitboard assemblies 10 manufactured through a cutting step is provided withthe lens actuator pin grooves 127, so that during the camera module 100is manufactured, a lens actuator pin 41 of the lens actuator 40 iselectrically connected to the circuit board 11 of the molded circuitboard assembly 10 by welding or by attaching through a conducting resin.

It is understandable that compared with the manufacturing process of theseparated molded circuit board assembly 10 in the above first preferredembodiment of the present invention, in the joint board array operation,two adjacent base forming guide grooves 215 forming two molded bases 12are jointed together while the plurality of the light window formingblocks 214 are spaced with each other, so that the molding material 14eventually forms the integral piece of molded base array 1200 with anoverall configuration.

In the step of manufacturing the separated molded circuit boardassemblies 10, the integral piece of molded circuit board assembly array1000 is cut into a plurality of molded circuit board assemblies 10 tomanufacture the separated camera module. Alternatively, two or moremolded circuit board assemblies 10 which are combined with each otherfrom the integral piece of molded circuit board assembly array 1000 areseparated by cutting so as to manufacture a split type cameral modulearray. In other words, each of the camera modules of the cameral modulearray has an individual molded circuit board assembly 10, wherein two ormore molded circuit board assemblies 10 are respectively electricallyconnected to a controlling mainboard of the same electronic device. Thusthe cameral module array manufactured by two or more molded circuitboard assemblies 10 transmits the images captured by the cameral modulesto the controlling mainboard for image information processing.

As shown in FIG. 22 of the drawings, the molding process of the jointboard array operation also can be used to make a molded circuit boardassembly 10 with two or more light windows 122, wherein the moldedcircuit board assembly 10 can be used to make a cameral module arraysharing a same base. In other words, take the molded circuit boardassembly 10 of an array of double camera modules as an example, for eachof the circuit boards 11 of the integral piece of circuit board array1100 in the molding process, one base board 111 is correspondinglyprovided with two light window forming blocks 214. The light windowforming blocks 214 are spaced with each other and two base forming guidegrooves which are communicated with each other are disposed around thelight window forming block 214. Therefore, after the molding process,the circuit board 11 together form an integral molded base which sharesone base board 111 and have two light windows 122, and that twophotosensitive elements 13 and two lenses 30 are then correspondinglymounted. Furthermore, the base board 111 of the circuit board 11 can beconnected to a controlling board of an electric board, and thus thecamera module array manufactured in this embodiment transmits the imagescaptured by the camera modules to the controlling mainboard for imageinformation processing.

It is worth mentioning that a press-fit distance W is formed on an outeredge of the base board 111 of the circuit board 11 and the outer sidesurface 125 of the formed molded base 12, so that it is facilitating todemould and to press-fit the base board 111 of the circuit board 11. Thepress-fit distance W has a range of 0.1˜0.6 mm. In a specific example,the press-fit distance W is 0.2 mm.

As shown in FIG. 23 of the drawings, according to an alternative mode ofthe above preferred embodiments of the present invention, the moldedbase 12 is extended integrally and upwardly to form a lens mountingportion 16. The lens mounting portion 16 has a through hole 161 forinstalling the lens 30. It is worth mentioning that one of the lightwindow forming block 214 and the dividing blocks 216 may have anarc-shaped chamfering transition in the angular position, and it isunderstandable that in the above-described embodiments, both of thelight window forming block 214 and the dividing blocks 216 areconfigured to have arc-shaped chamfered transitions to prevent damage tothe formed molded base 12 during demoulding.

As shown in FIG. 24 of the drawings, according to another alternativemode of the above preferred embodiments of the present invention, beforethe molding process, the photosensitive element 13 connected to thecircuit board 11 by the lead wires 15 is provided with an annularblocking element 17. The blocking element 17, which is attached orcoated on the circuit board 11, is made of elastic material andpositioned higher than a highest point of each of the lead wires 15, sothat during the molding process, the light window forming block 214 ispress-fit against the blocking element 17 to prevent the light windowforming block 214 from contacting and damaging the circuit board 11, thelead wires 15 and the photosensitive element 13. In some embodiments,the blocking element 17 is square ring-shaped and is implemented as astep adhesive configuration.

Referring to FIG. 11 to FIG. 15 of the drawings, the camera module 100of the second preferred embodiment of the present invention is furtherillustrated. The camera module 100 comprises a molded circuit boardassembly 10. The molded circuit board assembly 10 comprises a circuitboard 11 and a molded base 12. The camera module 100 further comprises alens 30. Wherein the molded base 12 comprises an annular molding body121 and has a light window 122 in a middle portion thereof to provide alight path for the lens 30 and the photosensitive element 13. Thephotosensitive element 13 is operatively connected to the circuit board11. For example, the photosensitive element 13 is connected to thecircuit board 11 by leading wires in a COB process, and thephotosensitive element 13 is positioned on a top side of the circuitboard 11. The photosensitive element 13 and the lens 30 are respectivelyassembled on two sides of the molded base 12 and are optically alignedin such a manner that the light passing through the lens 30 is able toreach the photosensitive element 13 through the light window 122, sothat the camera module 100 is able to provide an optical image through aphotoelectric conversion process. As shown in FIG. 25 of the drawings,the camera module 100 applied on an intelligent electronic device 300 isillustrated. For example, the camera module 100 is equipped in a mobilephone and is arranged along a thickness direction of the mobile phone.In addition, one or more camera modules 100 can be assembled at thefront and the back of the mobile phone.

The difference between this embodiment and the above first preferredembodiment is that a top groove 123 is formed on a top side of themolded base 12 for mounting the optical filter 50. Alternatively, asshown in FIG. 12 of the drawings, the top groove 123 is used to supportan additional optical filter holder 60 for mounting the optical filter50.

Correspondingly, the circuit board 11 comprises a base board 111 and aplurality of electronic components 112. The plurality of electroniccomponents 112 is formed on the base board 111 using a technology suchas the surface mount technology, SMT. The electronic components 112 areenclosed by the molded base 12.

The molded base 12 has an inner side surface 124, an outer side surface125 and a top side surface 126. In other words, the inner side surface124 along the inner circumferential direction of the molded base 12, theouter side surface 125 along the outer circumferential direction of themolded base 12 and the annular top side surface 126 define a shape ofthe annular molding body 121.

In this embodiment, the cross section of the light window 12 is inmulti-step-shape such as two steps shaped. The inner side surface 124 ofthe molded base 12 is not a flatly extended flat inner surface, but acurved extending inner surface. More specifically, the inner sidesurface 124 is further integrally extended to provide a first portioninner side surface 1241, a second portion inner side surface 1242 and athird portion inner side surface 1243. As shown in the drawings, forexample, the camera module 100 being arranged along a vertical directionthereof, the first portion inner side surface 1241 is integrally andinclinedly extended from a top surface 1111 of the base board 111 of thecircuit board 11, the second portion inner side surface 1242 isbasically extended from the first portion inner side surface 1241 alonga horizontal direction, the third portion inner side surface 1243 isintegrally and inclinedly extended from the second portion inner sidesurface 1242. The annular molding body 121 of the molded base 12 iscorrespondingly formed with a base station portion 121 a on a bottomside, and a step portion 121 b which is integrally extended from thebase station portion 121 a. The step portion 121 b forms an overallannular step, or the step portion 121 b is a multi-section type such asthree-section type and one side of the molded base 12 may not have astep protrusion. The step portion 121 b has a relative larger diameterthan the base station portion 121 a. The inner surface of the basestation portion 121 a is the first portion inner side surface 1241 ofthe inner side surface 124 of the molded base 12. The inner surface ofthe step portion 121 b is the third portion inner side surface 1243 ofthe inner side surface 124 of the molded base 12. The top surface of thestep portion 121 b is the top side surface 126 of the molded base 12.

It is understandable that the first portion inner side surface 1241 anda straight line direction of the optical axis Y of the camera module 100define a first inclination angle α. In other words, when the cameramodule 100 is aligned along the vertical direction, the firstinclination angle α is defined between the first portion inner sidesurface 1241 and the vertical line (optical axis Y). The extendingdirection of the second portion inner side surface 1242 is substantiallyperpendicular to a straight line direction of the optical axis Y of thecamera module 100. A third inclination angle β is defined between thethird portion inner side surface 1243 and the straight line direction ofthe optical axis Y of the camera module 100. That is, when the cameramodule 100 is aligned in the vertical direction, the third portion innerside surface 1243 and the vertical line have the third inclination angleβ therebetween.

The outer side surface 125 of the molded base 12 which is extended fromthe 1111 of the base board 111 of the circuit board 11 comprises one ormore outer peripheral surfaces 1251. In the second preferred embodimentof the present invention, as the integrally connected integral piece ofmolded circuit board assembly array 1000 is manufactured and is cut intothe separated molded circuit board assemblies 10, some outer peripheralsurfaces 1251 of the outer side surface 125 of the molded base 12 of themolded circuit board assembly 10 are formed by cutting, so that theouter peripheral surfaces 1251 can be vertical flat surfaces, while atleast one of the outer peripheral surfaces 1251 is defined by the baseouter side surface forming surface 2161 of the dividing blocks 216 ofthe molding mould 210 in the molding process. As shown in FIG. 15 toFIG. 19 of the drawings, the front outer peripheral surfaces 1251 of themolded circuit board assembly 10 obtained by cutting are formed by thebase outer side surface forming surface 2161 of the dividing blocks 216of the molding mould 210. The front outer peripheral surfaces 1251 andthe straight line direction of the optical axis Y of the camera module100 have a second inclination angle γ therebetween. In other words, whenthe camera module 100 is aligned in the vertical direction, the frontouter peripheral surfaces 1251 and the vertical line define the secondinclination angle γ. In addition, the molded base 12 is also formed withone or more lens actuator pin grooves 127. Each of the lens actuator pingrooves 127 has a pin groove wall 1271, as shown in FIG. 22. The pingroove wall 1271 and the straight line direction of the optical axis Yof the camera module 100 define a fourth inclination angle δ, as shownin FIG. 26. In other words, when the camera module 100 is aligned in thevertical direction, the pin groove wall 1271 and the vertical linedefine the fourth inclination angle δ therebetween.

According to this preferred embodiment of the present invention, theangle range of the first inclination angle α is 3°˜30°; while in otherembodiments, the angle range of the first inclination angle α can be 3°to 15°, or 15°˜20°, or 20°˜30°. The angle range of the secondinclination angle γ is 3° ˜45°; while in in other embodiments, the anglerange of the second inclination angle γ can be 3°˜15°, or 15°˜30°, or30°˜45°. The angle range of the third inclination angle β is 3°˜30°;while in in other embodiments, the angle range of the third inclinationangle β can be 3°˜15°, or 15°˜20°, or 20°˜30°. The angle range of thefourth inclination angle δ is 3°˜45°; while in in other embodiments, theangle range of the third angle β can be 3°˜15°, or 15°˜30°, or 30°˜45°.

The light window forming block 214 and the dividing blocks 216 areformed in a frustum-conical shape, wherein edges and corners of thelight window forming block 214 and the dividing blocks 216 are linearlytransitioned or smoothly transitioned in an arc shape. However, theextending angle ranges of the surfaces are substantially within theabove-mentioned specific range.

Correspondingly, the first mould 211 of the molding mould 210 isconfigured with an overall molding surface to form the molded base 12with the above structure. More specifically, as shown in the drawings,the light window forming block 214 has a press head portion 214 a in abottom side and a groove forming portion 214 b on a top side, as shownin FIG. 19. The press head portion 214 a and the groove forming portion214 b together are used to form the light window 122 of the molded base12. The groove forming portion 214 b is used to form the top groove 123on the top side of the molded base 12.

It is understandable that the light window forming block 214 has apress-fit surface 2141 on a bottom side and a base inner side surfaceforming surface 2142 along an outer circumferential direction.Furthermore, in this embodiment, the base inner side surface formingsurface 2142 of the light window forming block 214 has a first portionforming surface 21421, a second portion forming surface 21422 and athird portion forming surface 21423 which are integrally extended. Thefirst portion forming surface 21421, the second portion forming surface21422 and the third portion forming surface 21423 are respectively andcorrespondingly used for forming the first portion inner side surface1241, the second portion inner side surface 1242 and the third portioninner side surface 1243, which are integrally extended in an inner sideof the molded base 12.

According to the embodiment of the present invention, as shown in thedrawings, the camera module 100 is vertically aligned, the lineardirection of the optical axis Y of the photosensitive element 13 of thecamera module 100 is parallel to the vertical line. Correspondingly, thefirst portion forming surface 21421 and the vertical line define thefirst inclination angle α, ranging 3°˜30°, therebetween. The thirdportion forming surface 21423 and the vertical line define a thirdinclination angle (3, ranging 3°˜30°, therebetween.

Correspondingly, the bottom side surface of the press head portion 214 aforms the press-fit surface 2141 of the light window forming block 214.The outer side surface of the press head portion 214 a forms the firstportion forming surface 21421 of the light window forming block 214. Thebottom side surface of the groove forming portion 214 b forms the secondportion forming surface 21422 of the light window forming block 214. Theouter side surface of the groove forming portion 214 b forms the thirdportion forming surface 21423 of the base forming guide groove 215. Thepress head portion 214 a and the groove forming portion 214 b areconfigured to be a frustum-conical shape. The press head portion 214 aand the groove forming portion 214 b have trapezoid cross sections,thereby preventing damages on the elastic film layer 219. Morespecifically, take the groove forming portion 214 b as an example, themolding block in the prior art has sharp edges and corners, and in thedemoulding process, the film layer 219 is easy to be pierced on theposition where the second portion forming surface 21422 is connected tothe third portion forming surface 21423. As shown in FIG. 16, an obtuseangle is defined between the second portion forming surface 21422 on thebottom side of the groove forming portion 214 b and the third portionforming surface 21423 on the outer peripheral side of the groove formingportion 214 b so as to facilitate the demoulding of the groove formingportion 214 b.

Corresponding to that the outer side surface 125 of the molded circuitboard assembly 10 has at least one outer peripheral surfaces 1251, eachof the dividing blocks 216 has a base outer side surface forming surface2161. The base outer side surface forming surface 2161 and the verticalline define the second inclination angle γ, having a predetermined rangeof 3°˜45°, therebetween.

The molding mould 210 is further provided with a plurality of the lensactuator pin groove forming blocks 218, each having a pin groove sidesurface forming surface 2181. The pin groove side surface formingsurface 2181 and the vertical line define the fourth inclination angleδ, having a predetermined range of 3°˜30°, therebetween.

Correspondingly, the above structure of the first mould 211 of themolding mould 210 and the molded base 12 has the following advantages.

Firstly, it is convenient for demoulding of the dividing blocks 216 andthe light window forming block 214 of the first mould 211. In otherwords, as the first inclination angle α, the second inclination angle γ,the third inclination angle (3, and the fourth inclination angle δ,which are acute angles, are provided to facilitate demoulding, the lightwindow forming block 214 and the dividing blocks 216 have reducedfrictions with the molded base 12, and that the molded base 12 is easyto be detached to obtain a better molded condition. As shown in FIG. 19of the drawings, as along as the light window forming block 214 and thedividing blocks 216 are departed from the molded base 12 and have upwardand downward relative displacements, there is no frictions between thelight window forming block 214 and the dividing blocks 216 with themolded base 12. In other words, the first portion forming surface 21421,the second portion forming surface 21422 and the third portion formingsurface 21423 of the light window forming block 214 are respectivelyseparated with the first portion inner side surface 1241, the secondportion inner side surface 1242 and the third portion inner side surface1243 of the molded base 12, and that the base outer side surface formingsurface 2161 of the dividing blocks 216 and the outer side surface 125of the molded base 12 are separated, so that the light window formingblock 214 and the dividing blocks 216 are capable of being easilydetached from the molded base 12, thereby reducing the adverse influenceto the molded condition of the molded base 12.

Secondly, the shape of the integral base array forming guide groove 2150formed by the molding mould 210 has no right-angled corner and has asuitable gradient such that the liquid state molding material 14 has abetter liquidity filling the base forming guide groove 215. In otherwords, as the molding material 14 is generally in a liquid state duringthe molding process and is needed to flow into the molding chamber 213,the size of flowing area influences the filling effect of the moldingmaterial 14. The structure of the integral base array forming guidegroove 2150 in the embodiment of the present invention increases theflowing rate of the molding material 14, so that the molded base 12 ismolded in a shorter time and is benefit for the molding of the moldedbase 12.

Thirdly, the first inclination angle α, the second inclination angle γ,the third inclination angle (3, and the fourth inclination angle δ areacute angles, unlike the right angle in the prior art, so that the lightwindow forming block 214 and the dividing blocks 216 will not have sharpedges and corners that would scratch and damage the inner side surface124 and the outer side surface 125 of the molded base 12.

Fourthly, as the first inclination angle α, the second inclination angleγ, the third inclination angle β, and the fourth inclination angle δ areacute angles, the inner side surface 124 of the molded base 12, at leastone portion of the outer side surface 125 and the pin groove wall 1271are in inclined shape, so that the size of the molded base 12 isrelatively smaller and the overall amount of the molding material 14needed to be filled is decreased too.

Fifthly, the acute angle range of the first inclination angle α and thethird inclination angle β are capable of avoiding the stray light toadversely affect the imaging quality of the camera module 100. Morespecifically, it reduces the possibility of stray light reaching thephotosensitive element photosensitive element 13. That is, when theincident stray light in the camera module 100 is reflected by the curvedextending inner side surface 124 of the molded base 12, the inclinedfirst portion inner side surface 1241, the inclined third portion innerside surface 1243 and the second portion inner side surface 1242 whichis extended along the horizontal direction reflect the incident straylight away from the photosensitive element 13, so that the stray lightwill not reach the photosensitive element 13 to adversely affect theimage quality of the camera module 100.

In addition, the ranges of the first inclination angle α, the secondinclination angle γ and the third inclination angle β enable the moldedbase 12 having a better supporting ability. For example, the top sidesurface 126 would have enough size to facilitate the installation of thelens 30 or the lens actuator 40. It also ensures the second portioninner side surface 1242 having a sufficient size to facilitate theinstallation of the optical filter 50 or the optical filter holder 60.In other words, the first inclination angle α, the second inclinationangle γ and the third inclination angle β cannot be too large to avoidthe length of the top side surface 126 being too small so as to providea secure and stable installation site and position for the lens 30 orthe lens actuator 40.

Referring to FIG. 26 to FIG. 29 of the drawings, four examples of therange of the first inclination angle α, the second inclination angle γand the third inclination angle β according to the second embodiment ofthe present invention are illustrated respectively. According to thesefour examples, the first inclination angle α is defined between thefirst portion inner side surface 1241 of the molded base 12 and thevertical line, the second inclination angle γ is defined between atleast one outer peripheral surfaces 1251 of the outer side surface 125along the outer peripheral direction of the molded base 12 and thevertical line, and the third inclination angle β is defined between thethird portion inner side surface 1243 of the inner side surface 124 ofthe molded base 12 and the vertical line. A distance L1 is formedbetween the edge of photosensitive element 13 and a connecting positionof the first portion inner side surface 1241 of the molded base 12 andthe circuit board 11. A distance L2 is formed between a connectingposition of the first portion inner side surface 1241 and the circuitboard and a connecting position of the second portion inner side surface1242 and the third portion inner side surface 1243. A distance L3 isformed between a connecting position of the second portion inner sidesurface 1242 and the third portion inner side surface 1243 and aconnecting position of the outer side surface 125 of the molded base 12and the circuit board 11. L4 denotes a length of the top side surface126 of the molded base 12. The distance from the second portion innerside surface 1242 to the top surface of the base board 111 of thecircuit board 11 is H1. The distance from the top side surface 126 ofthe molded base 12 to the top surface of the base board 111 of thecircuit board 11 is H2.

In addition, the second inclination angle γ and the third inclinationangle β should not too large so as to ensure that the second portioninner side surface 1242 and the top side surface 126 have enough sizesto facilitate demoulding and avoid stray lights. In other words, theangle ranges of the second inclination angle γ and the third inclinationangle β have restrictive relations with respect to the above parametersL1, L2, L3, L4, H1 and H2.

As shown in FIG. 26 of the drawings, α is 3°, β is 3° and γ is 3°,wherein the L1 numerical value is 0.25 mm, the L2 numerical value is0.21 mm, the L3 numerical value is 1.25 mm, the L4 numerical value is1.18 mm, the H1 numerical value is 0.29 mm, and the H2 numerical valueis 0.78 mm, so that each of the first inclination angle α, the secondinclination angle γ and the third inclination angle β has an appropriateminimum value accordingly.

As shown in FIG. 27 of the drawings, α is 15°, β is 15° and γ is 15°,wherein the L1 numerical value is 0.25 mm, the L2 numerical value is0.21 mm, the L3 numerical value is 1.25 mm, the L4 numerical value is0.91 mm, the H1 numerical value is 0.29 mm, and the H2 numerical valueis 0.78 mm.

As shown in FIG. 28 of the drawings, α is 20°, β is 15° and γ is 10°,wherein the L1 numerical value is 0.25 mm, the L2 numerical value is0.21 mm, the L3 numerical value is 1.25 mm, the L4 numerical value is0.98 mm, the H1 numerical value is 0.29 mm, and the H2 numerical valueis 0.78 mm.

As shown in FIG. 29 of the drawings, α is 30°, β is 30° and γ is 45°,wherein the L1 numerical value is 0.28 mm, the L2 numerical value is0.38 mm, the L3 numerical value is 1.05 mm, the L4 numerical value is0.41 mm, the H1 numerical value is 0.32 mm, and the H2 numerical valueis 0.52 mm, so that each of the first inclination angle α, the secondinclination angle γ and the third inclination angle β has an appropriatemaximum value correspondingly.

It is understandable that the numerical values of above parameters L1,L2, L3, L4, H1, and H2 are exemplary only and not intended to belimiting the scope of the present invention. In the practicalapplications, the numerical values thereof may change with thespecification requirements of the camera module 100 and the moldedcircuit board assembly 10.

According to this embodiment of the present invention, it is illustratedfrom the above-exemplified data that an appropriate range of the firstinclination angle α is 3° to 30°, an appropriate range of the secondinclination angle γ is 3° to 45°, and an appropriate range of the thirdinclination angle β is 3° to 30°.

One skilled in the art will understand that the embodiment of thepresent invention as shown in the drawings and described above isexemplary only and not intended to be limiting.

It will thus be seen that the objects of the present invention have beenfully and effectively accomplished. The embodiments have been shown anddescribed for the purposes of illustrating the functional and structuralprinciples of the present invention and is subject to change withoutdeparture from such principles. Therefore, this invention includes allmodifications encompassed within the spirit and scope of the followingclaims.

1: A manufacturing method of molded circuit board assembly for cameramodule, comprising the steps of: (a) providing a circuit board adaptedfor mounting at least a photosensitive element, which has aphotosensitive area portion and a non-photosensitive area portionsurrounding said photosensitive area portion, on said circuit board andelectrically connecting with said non-photosensitive area portion ofsaid photosensitive element through one or more connecting elements; (b)integrally molding at least an annular molding body on said circuitboard though a molding process to embed one or more electroniccomponents therein and defining at least one light window formed in saidmolding body to form a molded base adapted for mounting a lens on top ofsaid molding body, wherein said light window has a size at least equalto a size of said photosensitive area portion of said photosensitiveelement; and (c) forming an annular inner side surface in said moldingbody which is integrally extended from said circuit board to define saidlight window positioned between a lens and said photosensitive elementsuch that a light passing through said lens is able to reach thephotosensitive element via said light window, wherein at least oneportion of said inner side surface is inclinedly extended upwardly andoutwardly from said circuit board, wherein said inner side surface ofsaid molding body of said molded base and an optical axis line directionof said camera module define an inclination angle α having an anglerange of 3° to 30° for facilitating demoulding in said molding processand avoiding stray light, wherein said molding body of said molded basehas an annular outer side surface inclinedly extended upwardly andinwardly from said circuit board, wherein said outer side surface ofsaid molding body of said molded base and said optical axis linedirection of said camera module define an inclination angle γ having anangle range of 3° to 45° for facilitating demoulding in said moldingprocess. 2: The manufacturing method, as recited in claim 1, before thestep (a), further comprising the steps of: (i) mounting at least aphotosensitive element on said circuit board; and (ii) electricallyconnecting said photosensitive element with said circuit board throughsaid one or more connecting elements. 3: The manufacturing method, asrecited in claim 1, after the step (c), further comprising the steps of:(i) mounting at least a photosensitive element on said circuit boardwithin said light window; and (ii) electrically connecting saidphotosensitive element with said circuit board through said one or moreconnecting elements within said light window. 4: The manufacturingmethod, as recited in claim 1, further comprising a step of: (d) forminga top groove on a top end of said molded base, wherein said inner sidesurface of said molded base has a first portion inner side surface, asecond portion inner side surface and a third portion inner side surfacewhich are successively and integrally extended upwardly and outwardly,wherein said first portion inner side surface is integrally andinclinedly extended from said circuit board, said second portion innerside surface is a horizontal surface extended outwardly between saidfirst and second inner side surfaces, and said third portion inner sidesurface is integrally and inclinedly extended upwardly and outwardlyfrom said second portion inner side surface, wherein said second portioninner side surface and said third portion inner side surface define saidtop groove. 5: The manufacturing method, as recited in claim 2, furthercomprising a step of: (d) forming a top groove on a top end of saidmolded base, wherein said inner side surface of said molded base has afirst portion inner side surface, a second portion inner side surfaceand a third portion inner side surface which are successively andintegrally extended upwardly and outwardly, wherein said first portioninner side surface is integrally and inclinedly extended from saidcircuit board, said second portion inner side surface is a horizontalsurface extended outwardly between said first and second inner sidesurfaces, and said third portion inner side surface is integrally andinclinedly extended upwardly and outwardly from said second portioninner side surface, wherein said second portion inner side surface andsaid third portion inner side surface define said top groove. 6: Themanufacturing method, as recited in claim 3, further comprising a stepof: (d) forming a top groove on a top end of said molded base, whereinsaid inner side surface of said molded base has a first portion innerside surface, a second portion inner side surface and a third portioninner side surface which are successively and integrally extendedupwardly and outwardly, wherein said first portion inner side surface isintegrally and inclinedly extended from said circuit board, said secondportion inner side surface is a horizontal surface extended outwardlybetween said first and second inner side surfaces, and said thirdportion inner side surface is integrally and inclinedly extendedupwardly and outwardly from said second portion inner side surface,wherein said second portion inner side surface and said third portioninner side surface define said top groove. 7: The manufacturing method,as recited in claim 1, further comprising a step of mounting at least anoptical filter on said molding body of said molded base, wherein saidoptical filter is positioned above said light window and at least saidphotosensitive area portion of said photosensitive element to filtersaid light passing through said lens before reaching said photosensitiveelement via said light window. 8: The manufacturing method, as recitedin claim 5, further comprising a step of: (e) mounting at least anoptical filter on said molding body of said molded base, wherein saidoptical filter is positioned above said light window and at least saidphotosensitive area portion of said photosensitive element to filtersaid light passing through said lens before reaching said photosensitiveelement via said light window. 9: The manufacturing method, as recitedin claim 6, further comprising a step of: (e) mounting at least anoptical filter on said molding body of said molded base, wherein saidoptical filter is positioned above said light window and at least saidphotosensitive area portion of said photosensitive element to filtersaid light passing through said lens before reaching said photosensitiveelement via said light window. 10: The manufacturing method, as recitedin claim 5, further comprising the steps of: (e) mounting at least anoptical filter holder in said top groove of said molding body of saidmolded base; and (f) mounting an optical filter on said optical filterholder, wherein said optical filter is positioned above said lightwindow and at least said photosensitive area portion of saidphotosensitive element to filter said light passing through said lensbefore reaching said photosensitive element via said light window. 11:The manufacturing method, as recited in claim 6, further comprising thesteps of: (e) mounting at least an optical filter holder in said topgroove of said molding body of said molded base; and (f) mounting anoptical filter on said optical filter holder, wherein said opticalfilter is positioned above said light window and at least saidphotosensitive area portion of said photosensitive element to filtersaid light passing through said lens before reaching said photosensitiveelement via said light window. 12: The manufacturing method, as recitedin claim 8, wherein said first portion inner side surface of said moldedbase and an optical axis line direction of said camera module definesaid inclination angle α having said angle range of 3° to 30° forfacilitating said demoulding process, wherein said third portion innerside surface of said molded base and said optical axis line direction ofsaid camera module define an inclination angle β having an angle rangeof 3° to 30°. 13: The manufacturing method, as recited in claim 9,wherein said first portion inner side surface of said molded base and anoptical axis line direction of said camera module define saidinclination angle α having said angle range of 3° to 30° forfacilitating said demoulding process, wherein said third portion innerside surface of said molded base and said optical axis line direction ofsaid camera module define an inclination angle β having an angle rangeof 3° to 30°. 14: The manufacturing method, as recited in claim 10,wherein said first portion inner side surface of said molded base and anoptical axis line direction of said camera module define saidinclination angle α having said angle range of 3° to 30° forfacilitating said demoulding process, wherein said third portion innerside surface of said molded base and said optical axis line direction ofsaid camera module define an inclination angle β having an angle rangeof 3° to 30°. 15: The manufacturing method, as recited in claim 11,wherein said first portion inner side surface of said molded base and anoptical axis line direction of said camera module define saidinclination angle α having said angle range of 3° to 30° forfacilitating said demoulding process, wherein said third portion innerside surface of said molded base and said optical axis line direction ofsaid camera module define an inclination angle β having an angle rangeof 3° to 30°. 16: The manufacturing method, as recited in claim 12,wherein said angle range of said inclination angle α is 3° to 15°,wherein said angle range of said inclination angle γ is 3° to 15°,wherein said angle range of said inclination angle β is 3° to 15°. 17:The manufacturing method, as recited in claim 12, wherein said anglerange of said inclination angle α is 15° to 20°, wherein said anglerange of said inclination angle γ is 15° to 30°, wherein said anglerange of said inclination angle β is 15° to 20°. 18: The manufacturingmethod, as recited in claim 12, wherein said angle range of saidinclination angle α is 20° to 30°, wherein said angle range of saidinclination angle γ is 30° to 45°, wherein said angle range of saidinclination angle β is 20° to 30°. 19: The manufacturing method, asrecited in claim 15, wherein said angle range of said inclination angleα is 3° to 15°, wherein said angle range of said inclination angle γ isselected from the range group consisting of 3° to 15°, wherein saidangle range of said inclination angle is selected from the range groupconsisting of 3° to 15°. 20: The manufacturing method, as recited inclaim 16, wherein said circuit board comprise a base board, wherein atan outer side of at least one outer peripheral surface of said outerside surface of said molding body of said molded base, said base boardof said circuit board has a press-fit distance W, wherein a numericalvalue range of said press-fit distance W is 0.1 to 0.6 mm. 21: Themanufacturing method, as recited in claim 17, wherein said circuit boardcomprise a base board, wherein at an outer side of at least one outerperipheral surface of said outer side surface of said molding body ofsaid molded base, said base board of said circuit board has a press-fitdistance W, wherein a numerical value range of said press-fit distance Wis 0.1 to 0.6 mm. 22: The manufacturing method, as recited in claim 18,wherein said circuit board comprise a base board, wherein at an outerside of at least one outer peripheral surface of said outer side surfaceof said molding body of said molded base, said base board of saidcircuit board has a press-fit distance W, wherein a numerical valuerange of said press-fit distance W is 0.1 to 0.6 mm. 23: Themanufacturing method, as recited in claim 19, wherein said circuit boardcomprise a base board, wherein at an outer side of at least one outerperipheral surface of said outer side surface of said molding body ofsaid molded base, said base board of said circuit board has a press-fitdistance W, wherein a numerical value range of said press-fit distance Wis 0.1 to 0.6 mm. 24: The manufacturing method, as recited in claim 20,wherein a material surface reflectivity of said molded base is less than5% in a wavelength range of 435 nm to 660 nm. 25: The manufacturingmethod, as recited in claim 21, wherein a material surface reflectivityof said molded base is less than 5% in a wavelength range of 435 nm to660 nm. 26: The manufacturing method, as recited in claim 22, wherein amaterial surface reflectivity of said molded base is less than 5% in awavelength range of 435 nm to 660 nm. 27: The manufacturing method, asrecited in claim 23, wherein a material surface reflectivity of saidmolded base is less than 5% in a wavelength range of 435 nm to 660 nm.28: The manufacturing method, as recited in claim 1, before the step(b), further comprising a step of placing an annular blocking element onsaid circuit board, wherein, after the step (b), said blocking elementis positioned between said circuit board and said molding body. 29: Themanufacturing method, as recited in claim 26, before the step (b),further comprising a step of placing an annular blocking element on saidcircuit board, wherein, after the step (b), said blocking element ispositioned between said circuit board and said molding body. 30: Themanufacturing method, as recited in claim 27, before the step (b),further comprising a step of placing an annular blocking element on saidcircuit board, wherein, after the step (b), said blocking element ispositioned between said circuit board and said molding body.